? 1/7 EMIF10-LCD01F2 10 lines emi filter and esd protection rev. 2 flip-chip (25 bumps) march 2005 main product characteristics: where emi filtering in esd sensitive equipment is required : lcd for mobile phones computers and printers communication systems mcu boards description the EMIF10-LCD01F2 is a 10 lines highly inte- grated devices designed to suppress emi/rfi noise in all systems subjected to electromagnetic interferences. the emif10 flip-chip packaging means the package size is equal to the die size. this filter includes an esd protection circuitry, which prevents the device from destruction when subjected to esd surges up 15kv. benefits emi symmetrical (i/o) low-pass filter high efficiency in emi filtering very low pcb space consuming: < 7mm 2 lead free package very thin package: 0.69 mm high efficiency in esd suppression on input pins (iec61000-4-2 level 4) high reliability offered by monolithic integration high reducing of parasitic elements through integration and wafer level packaging. complies with the following standards: iec61000-4-2: level 4 input pins 15kv (air discharge) 8kv (contact discharge) mil std 833e - method 3015-6 class 3 table 1: order code part number marking EMIF10-LCD01F2 fl ipad? figure 1: pin configuration (ball side) a b c d e 1 2 3 4 5 o10 o8 o6 o4 o2 o9 o7 o5 o3 o1 i10 i8 i6 i4 i2 i9 gnd gnd gnd i5 i1 i7 gnd gnd i3 figure 2: basic cell configuration input gnd gnd gnd output low-pass filter ri/o = 100 cline = 35pf ? tm: ipad is a trademark of stmicroelectronics.
EMIF10-LCD01F2 2/7 table 2: absolute maximum ratings (t amb = 25c) table 3: electrical characteristics (t amb = 25c) symbol parameter value unit t j junction temperature 125 c t op operating temperature range -40 to + 85 c t stg storage temperature range -55 to +150 c symbol parameter v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic resistance i pp peak pulse current r i/o series resistance between input & output c line input capacitance per line symbol test conditions min. typ. max. unit v br i r = 1 ma 6810v i rm v rm = 3v 500 na r i/o 90 100 110 ? c line @ 0v bias 28 35 pf rt / ft induced rise and fall time 10-90% at 26 mhz fre- quency signal v = 1.9 v (rt / ft input 1 ns, 50 ? impedance generator) 8 (1) ns (1) guaranteed by design figure 3: s21(db) all lines attenuation measurement and aplac simulation figure 4: analog cross talk measurements i v i f i rm i r i pp v rm v f v br v cl
EMIF10-LCD01F2 3/7 figure 5: esd response to iec61000-4-2 (+15kv air discharge) on one input and on one output figure 6: esd response to iec61000-4-2 (-15kv air discharge) on one input and on one output figure 7: line capacitance versus applied voltage figure 8: rise time 10-90% measurements with 1.9v signal at 26 mhz frequency (50 ? generator) figure 9: fall time 10-90% measurements with 1.9v signal at 26 mhz frequency (50 ? generator) v in v out v in v out 0 5 10 15 20 25 30 35 0.0 1.0 2.0 3.0 4.0 5.0 vline(v) cline(pf)
EMIF10-LCD01F2 4/7 figure 12: ordering information scheme figure 10: aplac model figure 11: aplac parameters EMIF10-LCD01F2 model ground return zrz structure aplacvar remif10low 100 aplacvar cemif10flow 17.5pf bumps aplacvar lbump 50ph aplacvar rbump 20m aplacvar cbump 1.5pf bulk aplacvar rsub 100m gnd connections aplacvar rgnd 100m aplacvar lgnd 200ph aplacvar cgnd 0.15pf bv = 7 cjo = cemif10low ibv = 1u ikf = 1000 is = 10f isr = 100p n = 1 m = 0.3333 rs = 0.015 vj = 0.6 tt = 50n emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f = flip-chip x = 1: 500m, bump = 315m = 2: leadfree pitch = 500m, bump = 315m = 3: leadfree pitch = 400m, bump = 250m
EMIF10-LCD01F2 5/7 figure 13: flip-chip package mechanical data figure 14: foot print recommendations figure 15: marking 250m 40 650m 65 2.64mm 50m 2.64mm 50m 315m 50 500m 50 500m 50 copper pad diameter : 250m recommended , 300m max solder stencil opening : 330m solder mask opening recommendation : 340m min for 315m copper pad diameter 545 545 400 100 230 x y x w z w dot, st logo xx = marking z = packaging location yww = datecode (y = year ww = week) all dimensions in m e
EMIF10-LCD01F2 6/7 figure 16: flip-chip tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 +/- 0.1 8 +/- 0.3 4 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 ? 1.5 +/- 0.1 0.73 +/- 0.05 st xxz yww st xxz yww st xxz yww e e e table 5: revision history date revision description of changes 14-feb-2005 1 first issue. 17-mar-2005 2 capacitance cline specification changed from 47pf (typ) to 28pf (typ) and 35pf (max). table 4: ordering information note: further packing information available in the application notes - an1235: ''flip-chip: package description and recommandations for use'' - an1751: "emi filters: recommendations and measurements" part number marking package weight base qty delivery mode EMIF10-LCD01F2 fl flip-chip 9.3 mg 5000 tape & reel (7?)
EMIF10-LCD01F2 7/7 information furnished is believed to be accurate and reliable. however, stmicroelectronics assu mes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replac es all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is a registered tr ademark of stmicroelectronics. all other names are the property of their respective owners ? 2005 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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